Liquid Cooling Guidelines Discuss IT Heat Load Solutions

02/06/2007


Heat loads generated by IT equipment can present significant problems for data centers by introducing effects such as decreased equipment availability, wasted floor space and inefficient cooling system operation. One solution, liquid cooling, is described in detail in ASHRAE’s new publication, “Liquid Cooling Guidelines for Datacom Equipment Centers.”

The guide covers a broad range of liquid cooling topics such as facility cooling systems, facility piping design, liquid cooling implementation for datacom equipment, liquid cooling infrastructure requirements for chilled water systems, and liquid cooling infrastructure requirements for technology cooling systems.

The book is the fourth in a series written by ASHRAE Technical Committee 9.9, Mission Control Facilities, Technology Spaces and Electronic Equipment.

“The book incorporates the experience of liquid cooling from the mainframe days,” said Roger Schmidt of IBM and chair of TC 9.9. “Liquid cooling is a proven technology, and the book provides a good central source of liquid cooling information from the datacom equipment to the facility level.”

For more about “Liquid Cooling Guidelines for Datacom Equipment Centers,” visit the Bookstore at www.ashrae.org .





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